carbonic acid diphenyl ester; copper; sodium hydrogencarbonate in N,N-dimethyl-formamide T=140 - 150°C;

carbonic acid diphenyl ester; copper; sodium hydrogencarbonate in N,N-dimethyl-formamide T=140 - 150°C;

1: 79 percent / 1.) Et3N, bis(triphenylphosphine)palladium(II) chloride / acetonitrile / 24 h / 80 °C 2: 99 percent / 0.5 N KOH / 2 h / 25 °C 3: 42 percent / triethylamine / dimethylformamide; H2O / 20 h / 100 °C 4: 65 percent / I2, KIO3, 5 N H2SO4 / H2O; acetonitrile / 0.5 h / 55 °C View Scheme

1: 79 percent / 1.) Et3N, bis(triphenylphosphine)palladium(II) chloride / acetonitrile / 24 h / 80 °C 2: 99 percent / 0.5 N KOH / 2 h / 25 °C 3: 42 percent / triethylamine / dimethylformamide; H2O / 20 h / 100 °C 4: 65 percent / I2, KIO3, 5 N H2SO4 / H2O; acetonitrile / 0.5 h / 55 °C 5: 81 percent / 5 N H2SO4 / 36 h / 25 °C View Scheme

copper(l) iodide; tetrakis(triphenylphosphine) palladium(0); triethylamine in N,N-dimethyl-formamide T=20°C; 18 h;

1: 86 percent / Pd(OAc)2, Ph3P, TEA / 1 h / Heating 2: 67 percent / aq. 1 N NaOH / Ambient temperature View Scheme

palladium diacetate; TEA; triphenylphosphine 1 h; Heating;

1: 92 percent / pyridine / 19 h / 20 °C 2: 73 percent / NEt3; CuI / Pd(PPh3)4 / acetone / 40 h / 20 °C View Scheme

sodium tetrachloropalladium (II) in acetate buffer; N,N-dimethyl-formamide T=80°C; Heck reaction; pH=5.2; 2 h;