in neat (no solvent) byproducts: N2O5; thermal degradation of Cu(3,5-dimethylpyrazole)3(NO3)2 involves two steps:1. formation of Cu(NO3)2 at temp. 140-160°C with loss of three 3,5-dimethylpyrazole; 2. formation of monoclinic CuO at temp. 300-450°C with loss of N2O5; TGA;