(2E)-2-氰基-2-[1-[2-(二甲基氨基甲基亚基氨基)-2-硫代乙基]吡咯烷-2-亚基]乙酸乙酯合成路线 （共 5 条）
反应条件
in ethanol 1.5 h; Ambient temperature;
参考文献
Kadushkin, A. V.; Golovko, T. V.; Kalistratov, S. G.; Sokolov, A. S.; Chernov, V. A.; Granik, V. G.
Pharmaceutical Chemistry Journal, 1987 , vol. 21, # 5 p. 317 - 322
Khimiko-Farmatsevticheskii Zhurnal, 1987 , vol. 21, # 5 p. 545 - 550
反应条件
1: 84 percent / 99.7percent formic acid, HCl / 2 h / 0 °C 2: 56 percent / Lawesson's Reagent / benzene / 3 h / 70 °C 3: 83 percent / ethanol / 1.5 h / Ambient temperature View Scheme
参考文献
Kadushkin, A. V.; Golovko, T. V.; Kalistratov, S. G.; Sokolov, A. S.; Chernov, V. A.; Granik, V. G.
Pharmaceutical Chemistry Journal, 1987 , vol. 21, # 5 p. 317 - 322
Khimiko-Farmatsevticheskii Zhurnal, 1987 , vol. 21, # 5 p. 545 - 550
反应条件
1: 68 percent / 2 h / 5 - 7 °C 2: 84 percent / 99.7percent formic acid, HCl / 2 h / 0 °C 3: 56 percent / Lawesson's Reagent / benzene / 3 h / 70 °C 4: 83 percent / ethanol / 1.5 h / Ambient temperature View Scheme
参考文献
Kadushkin, A. V.; Golovko, T. V.; Kalistratov, S. G.; Sokolov, A. S.; Chernov, V. A.; Granik, V. G.
Pharmaceutical Chemistry Journal, 1987 , vol. 21, # 5 p. 317 - 322
Khimiko-Farmatsevticheskii Zhurnal, 1987 , vol. 21, # 5 p. 545 - 550
反应条件
1: 68 percent / 2 h / 5 - 7 °C 2: 84 percent / 99.7percent formic acid, HCl / 2 h / 0 °C 3: 56 percent / Lawesson's Reagent / benzene / 3 h / 70 °C 4: 83 percent / ethanol / 1.5 h / Ambient temperature View Scheme
参考文献
Kadushkin, A. V.; Golovko, T. V.; Kalistratov, S. G.; Sokolov, A. S.; Chernov, V. A.; Granik, V. G.
Pharmaceutical Chemistry Journal, 1987 , vol. 21, # 5 p. 317 - 322
Khimiko-Farmatsevticheskii Zhurnal, 1987 , vol. 21, # 5 p. 545 - 550
反应条件
1: 56 percent / Lawesson's Reagent / benzene / 3 h / 70 °C 2: 83 percent / ethanol / 1.5 h / Ambient temperature View Scheme
参考文献
Kadushkin, A. V.; Golovko, T. V.; Kalistratov, S. G.; Sokolov, A. S.; Chernov, V. A.; Granik, V. G.
Pharmaceutical Chemistry Journal, 1987 , vol. 21, # 5 p. 317 - 322
Khimiko-Farmatsevticheskii Zhurnal, 1987 , vol. 21, # 5 p. 545 - 550
