3,4-二甲氧基苯甲醛合成路线 （共 996 条）
反应条件
1: 1.) 40percent formalin; 2.) KOH / 1.) methanol, 65 deg C; 2.) water, 70 deg C, 40 min, reflux, 20 min 2: 80 percent / Et3N, PBr3 / CCl4 / 2 h / Ambient temperature 3: ethanol; H2O / 5 h / Heating 4: 74.2 percent / KOH / methanol; H2O / 5 h / Heating 5: oxalyl chloride / benzene / 1 h / Ambient temperature View Scheme
参考文献
Chatterjee; Pandit
Journal of the Indian Chemical Society, 1989 , vol. 66, # 8-10 p. 656 - 659
反应条件
lithium chloride in N,N-dimethyl-formamide 22 h; Heating; Yield given. Yields of byproduct given;
参考文献
Bernard, Angela M.; Ghiani, M. Rossella; Piras, Pier Paolo; Rivoldini, Antonio
Synthesis, 1989 , # 4 p. 287 - 289
参考文献
Dreyfus
Patent: DE193958 ;
参考文献
Dreyfus
Patent: DE193958 ;
反应条件
1: 80 percent / ammonium acetate; acetic acid / 1.5 h / Heating 2: LiAlH4 / tetrahydrofuran / 3 h / Heating View Scheme
参考文献
Organic Letters, , vol. 8, # 8 p. 1525 - 1528
反应条件
1: 92 percent / HCl gas / dioxane / 1 h / Heating 2: 48 percent / chromium trioxide, 35percent H2SO4 / acetone; H2O / 2 h / Ambient temperature View Scheme
参考文献
Gatta; Piazza; Del Giudice; Massotti
Farmaco, Edizione Scientifica, 1985 , vol. 40, # 12 p. 942 - 955
反应条件
1: 85 percent / NH4Ac / toluene 2: 80 percent / NaBH4 / methanol 3: 91 percent / dimethylformamide / Heating 4: 60 percent / LiAlH4 / tetrahydrofuran View Scheme
参考文献
Jirkovsky,I.; Protiva,M.
Collection of Czechoslovak Chemical Communications, 1967 , vol. 32, # 3 p. 1197 - 1209
反应条件
1.1: acetyl chloride; acetamide / acetic acid / 4.5 h / 0 - 20 °C 1.2: PCl3 / acetic acid / 2 h / Heating 1.3: aq.HCl / 6 h 2.1: aq. HI / 6 h / Heating 3.1: NaIO4 / 0.17 h / pH 3.0 View Scheme
参考文献
Dreyfus
Patent: DE193958 ;
反应条件
1-methyl-pyrrolidin-2-one; potassium carbonate; thiophenol 0.25 h; Heating;
参考文献
Journal of Organic Chemistry, , vol. 67, # 18 p. 6406 - 6414
反应条件
lithium chloride in N,N-dimethyl-formamide 22 h; Heating; Yield given. Yields of byproduct given;
参考文献
Bernard, Angela M.; Ghiani, M. Rossella; Piras, Pier Paolo; Rivoldini, Antonio
Synthesis, 1989 , # 4 p. 287 - 289
