(三甲基硅基)甲基氯化镁合成路线 （共 130 条）
参考文献
Fleming, Ian; Pearce, Andrew
Journal of the Chemical Society, Perkin Transactions 1: Organic and Bio-Organic Chemistry (1972-1999), 1981 , p. 251 - 255
反应条件
1: in tetrahydrofuran; diethyl ether T=-70°C; 1 h; 2: With 2,3-dicyano-5,6-dichloro-p-benzoquinone in tetrahydrofuran; diethyl ether T=-70 - 0°C; 1 h;
参考文献
F. HOFFMANN-LA ROCHE AG
Patent: WO2008/25526 A1, 2008 ;
Location in patent: Page/Page column 25 ;
反应条件
in diethyl ether; hexane (N2), reaction at -78°C, stirring at -10°C to -5°C for 2 h; removal of the solvent, extn. (hexane), filtration (O°C), concn.,cooling (-78°C), standing (-78°C);
参考文献
Li, Liting; Hung, Meiling; Xue, Ziling
Journal of the American Chemical Society, 1995 , vol. 117, # 51 p. 12746 - 12750
反应条件
bis(acetylacetonate)nickel(II) in diethyl ether 16 h; Heating;
参考文献
Polla, Magnus; Frejd, Torbjoern
Acta Chemica Scandinavica, 1993 , vol. 47, # 7 p. 716 - 720
反应条件
diethyl ether T=-50 - -40°C;
参考文献
Prober
Journal of the American Chemical Society, 1955 , vol. 77, p. 3224,3226
反应条件
in diethyl ether mixt. of (CH3)3SiCH2MgCl and (CH3)3SiCl in ether; heating under evapn. of the ether during a longer period of time;;
参考文献
Sommer et al.
Journal of the American Chemical Society, 1947 , vol. 69, p. 980
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Sommer, L. H.; Mitch, F. A.; Godberg, G. M.
Journal of the American Chemical Society, 1949 , vol. 71, p. 2746 - 2750
反应条件
cerium(III) chloride
参考文献
Lee, Thomas V.; Porter, John R.; Roden, Frances S.
Tetrahedron Letters, 1988 , vol. 29, # 39 p. 5009 - 5012
反应条件
1: 2: Pummerer Sulfoxide Rearrangement; 5 h; Reflux; Temperature;
参考文献
Mikina, Maciej
Phosphorus, Sulfur and Silicon and the Related Elements, 2013 , vol. 188, # 4 p. 454 - 458
反应条件
lithium aluminium tetrahydride; trichlorosilane 1.) ether, reflux, overnight; Multistep reaction;
参考文献
Whitmarsh, Chris K.; Interrante, Leonard V.
Journal of Organometallic Chemistry, 1991 , vol. 418, # 1 p. 69 - 77
反应条件
in benzene Ring cleavage; alkylation; 6 h; Heating;
参考文献
Hsieh, Yu-Tsai; Luh, Tien-Yau
Heterocycles, 2000 , vol. 52, # 3 p. 1125 - 1131
