in toluene under protective gas; 8.8 mmol of the Li salt in toluene added to 4 mmol of the Pt complex in toluene at -20°C; mixt. warmed to 20°C and stirred for 2 d; filtration; filtrate evapd. in vac.; fractionated crystn.;
参考文献
Zeitschrift fuer Anorganische und Allgemeine Chemie, , vol. 560, p. 65 - 79
Et2NH; copper(l) iodide in tetrahydrofuran (Ar); CuI was added to suspn. of Pt complex in THF/Et2NH at 0°C; ethyne was bubbled through mixt. for 2 h; solvent removed (vac.); residue dissolved in CH2Cl2; washed (H2O); org. phase dried (MgSO4); filtered; filtrate passed through alumina; solvent removed; recrystd. (CH2Cl2/ether); dried (vac.);
参考文献
Janka, Mesfin; Anderson, Gordon K.; Rath, Nigam P.
Organometallics, 2004 , vol. 23, # 19 p. 4382 - 4390
copper(l) iodide in diethylamine to a soln. of the Pt-complex in Et2NH in presence of CuI is added the alkine at room temp. (react. time 1 h under N2); solvent is evapd., residue is treated with benzene and the soln. chromd. (Al2O3, benzene);
参考文献
Sebald, Angelika; Wrackmeyer, Bernd; Beck, Wolfgang
Zeitschrift fuer Naturforschung, Teil B: Anorganische Chemie, Organische Chemie, 1983 , vol. 38, # 1 p. 45 - 56
in toluene under protective gas; 8.8 mmol of the Li salt in toluene added to 4 mmol of the Pt complex in toluene at -20°C; mixt. warmed to 20°C and stirred for 2 d; filtration; filtrate evapd. in vac.; fractionated crystn.;
参考文献
Zeitschrift fuer Anorganische und Allgemeine Chemie, , vol. 560, p. 65 - 79
HCl in dichloromethane N2-atmosphere; addn. of SFO2(OMe) to Pt-complex, refluxing for 30 min, addn. of excess concd. HCl, standing for 5 min; drying of org. layer (CaSO4), evapn.;
参考文献
Eaborn, C.; Farrell, N. F.; Murphy, J. L.; Pidcock, A.
Journal of the Chemical Society, Dalton Transactions: Inorganic Chemistry (1972-1999), 1976 , p. 58 - 67
{Pt2(P(C2H5)3)2Cl4} in benzene isomerization; equilibrium;;
参考文献
Cahours, A.; Gal, H.
Comptes Rendus Hebdomadaires des Seances de l'Academie des Sciences, 1870 , vol. 70, p. 902 - 902
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Cahours, A.; Gal, H.
Liebigs Annalen der Chemie, 1870 , vol. 155, p. 228 - 228
