1: 58.3 percent / CsF, N,N-diethylaniline / 26.5 h / 215 °C 2: 77 percent / OsO4, pyridine / 2 h / Ambient temperature 3: 70 percent / HIO4*2H2O / H2O; dioxane / 2 h / Ambient temperature 4: 92 percent / K2CO3 / dimethylformamide / 2 h / Ambient temperature 5: 49 percent / 1.) p-toluenesulfonic acid, 2.) aq. 10percent HCl / xylene / 7.5 h / Heating View Scheme

1: CsF / various solvent(s) / 215 °C 3: 2.) p-toluenesulfonic acid / 1.) xylene, 2.) reflux View Scheme

1: 58.3 percent / CsF, N,N-diethylaniline / 26.5 h / 215 °C 2: 77 percent / OsO4, pyridine / 2 h / Ambient temperature 3: 70 percent / HIO4*2H2O / H2O; dioxane / 2 h / Ambient temperature 4: 92 percent / K2CO3 / dimethylformamide / 2 h / Ambient temperature 5: 49 percent / 1.) p-toluenesulfonic acid, 2.) aq. 10percent HCl / xylene / 7.5 h / Heating 6: 76 percent / NaBH4 / methanol / 0.5 h / Ambient temperature View Scheme