6-硫唑嘌呤双环[3.2.0]庚烷-7-酮合成路线 （共 8 条）
反应条件
1: T=-75 - 20°C; 2 h; 2: With sodium hydrogencarbonate; sodium sulfite in water T=0°C;
参考文献
Zahn, Stephan Karl; Boehmelt, Guido; Mantoulidis, Andreas; Reiser, Ulrich; Treu, Matthias; Guertler, Ulrich; Schoop, Andreas; Solca, Flavio; Tontsch-Grunt, Ulrike; Brueckner, Ralph; Reither, Charlotte; Herfurth, Lars; Kraemer, Oliver; Stadtmueller, Heinz; Engelhardt, Harald
Patent: US2007/32514 A1, 2007 ;
Location in patent: Page/Page column 18 ;
US 20070032514 A1
反应条件
1: 70 percent / toluene / 13 h / 0 - 20 °C 2: aq. Na2SO3 View Scheme
参考文献
Bioorganic and Medicinal Chemistry Letters, , vol. 15, # 5 p. 1371 - 1373
反应条件
SiO2-Cl; sodium hydrogencarbonate T=0°C; 0.333333 h;
参考文献
Sathe, Manisha; Ghorpade, Ramarao; Kaushik, Mahabir Parshad
Chemistry Letters, 2006 , vol. 35, # 9 p. 1004 - 1005
反应条件
1.1: EtONa / ethanol / 12 h / Heating 1.2: 78 percent / 18 percent aq. HCl / 24 h / Heating 2.1: 78 percent / SOCl2 / 3.5 h / 0 - 20 °C View Scheme
参考文献
Csomos, Peter; Bernath, Gabor; Fueloep, Ferenc
Monatshefte fur Chemie, 2002 , vol. 133, # 8 p. 1077 - 1084
反应条件
lipase acrylic resin from Candida antarctica in di-isopropyl ether; water T=60°C; 264 h;
参考文献
Zahn, Stephan Karl; Boehmelt, Guido; Mantoulidis, Andreas; Reiser, Ulrich; Treu, Matthias; Guertler, Ulrich; Schoop, Andreas; Solca, Flavio; Tontsch-Grunt, Ulrike; Brueckner, Ralph; Reither, Charlotte; Herfurth, Lars; Kraemer, Oliver; Stadtmueller, Heinz; Engelhardt, Harald
Patent: US2007/32514 A1, 2007 ;
Location in patent: Page/Page column 18 ;
US 20070032514 A1
反应条件
immobilized lipase B from Candida antarctica; water in di-isopropyl ether T=60°C; 249 h;
参考文献
Organic letters, , vol. 5, # 8 p. 1209 - 1212
反应条件
water in di-isopropyl ether T=60°C; 240 h; Inert atmosphereEnzymatic reaction;
参考文献
Lengyel, George A.; Frank, Rebecca C.; Horne, W. Seth
Journal of the American Chemical Society, 2011 , vol. 133, # 12 p. 4246 - 4249
反应条件
Candida antarctica lipase B; water T=70°C; 120 h;
参考文献
Forro, Eniko; Fueloep, Ferenc
Tetrahedron Asymmetry, 2008 , vol. 19, # 8 p. 1005 - 1009
