1.1: 100 percent / K2CO3 / dimethylformamide / 3 h / 0 °C 2.1: 97 percent / DIBAH / CH2Cl2 / 3 h / -78 °C 3.1: 76 percent / PCC / CH2Cl2 / 2 h / 20 °C 4.1: 30 percent aq. hydrogen peroxide; phenylselenic acid / CH2Cl2 / 48 h / 20 °C 4.2: KOH / methanol / 0.5 h / 20 °C 5.1: KOH / dimethylsulfoxide / 3 h / 20 °C 6.1: 100 percent / hydrogen / 20 percent Pd(OH)2/C / methanol / 18 h / 20 °C 7.1: 98 percent / pyridine / diethyl ether / 4 h / 20 °C 8.1: AlCl3 / CH2Cl2 / 3 h / 20 °C 8.2: 94 percent / aq. HCl / methanol / 0.5 h / Heating 9.1: 60 percent / Huenig base / CH2Cl2 / 24 h / 20 °C 10.1: 77 percent / aq. K2CO3; n-Bu3NHSO4 / benzene / 20 h / 20 °C 11.1: NaH / dimethylsulfoxide / 3 h / 20 °C 11.2: aq. oxalic acid / 0 °C 11.3: AcOH; conc. HCl / 1.5 h 12.1: (COCl)2; DIPEA; DMSO / CH2Cl2 / 0.5 h / -78 - 20 °C 13.1: HMPA / tetrahydrofuran / 16 h / -85 - 20 °C View Scheme

1: copper / N,N-dimethyl acetamide / 0.25 h / 200 °C / |Inert atmosphere 2: potassium hydroxide; water / methanol; tetrahydrofuran / 42 h / 20 - 60 °C 3: palladium 10 on activated carbon; hydrogen / methanol / 2 h / 20 °C View Scheme