4-苄氧基吲哚-2-羧酸合成路线 （共 13 条）
反应条件
hydrogen; palladium on activated charcoal in ethanol; ethyl acetate P=2585.7 Torr; 3 h; Ambient temperature;
参考文献
Journal of Medicinal Chemistry, , vol. 34, # 4 p. 1283 - 1292
反应条件
1: quinaldine; copper-powder / 245 - 250 °C 2: acetic acid; ethanol 3: CH3I / Erwaermen des Reaktionsprodukts mit NaCN in H2O View Scheme
参考文献
Stoll et al.
Helvetica Chimica Acta, 1955 , vol. 38, p. 1452,1469
反应条件
1: quinaldine; copper-powder / 245 - 250 °C 2: acetic acid; ethanol View Scheme
参考文献
Helvetica Chimica Acta, , vol. 38, p. 1452,1469
反应条件
2-Methyl quinoline; copper T=245 - 250°C;
参考文献
Stoll et al.
Helvetica Chimica Acta, 1955 , vol. 38, p. 1452,1469
反应条件
1: quinaldine; copper-powder / 245 - 250 °C 2: methanol; palladium/ asbestos / Hydrogenation View Scheme
参考文献
Stoll et al.
Helvetica Chimica Acta, 1955 , vol. 38, p. 1452,1469
反应条件
sodium hydroxide in ethanol
0.25 h; Heating;
参考文献
Gray, Nancy M.; Dappen, Michael S.; Cheng, Brian K.; Cordi, Alexis A.; Biesterfeldt, John P.; et al.
Journal of Medicinal Chemistry, 1991 , vol. 34, # 4 p. 1283 - 1292
反应条件
1-methyl-piperazine in epichlorohydrin
参考文献
The Board of Trustees of the Leland Stanford Junior University
Patent: US5229412 A1, 1993 ;
反应条件
1: toluene / 3 h / Heating
2: 79 percent / 50percent aq. NaOH / ethanol / 0.25 h / Heating
View Scheme
参考文献
Gray, Nancy M.; Dappen, Michael S.; Cheng, Brian K.; Cordi, Alexis A.; Biesterfeldt, John P.; et al.
Journal of Medicinal Chemistry, 1991 , vol. 34, # 4 p. 1283 - 1292
反应条件
1: NaOEt / ethanol / 2 h / -10 °C
2: toluene / 3 h / Heating
3: 79 percent / 50percent aq. NaOH / ethanol / 0.25 h / Heating
View Scheme
参考文献
Gray, Nancy M.; Dappen, Michael S.; Cheng, Brian K.; Cordi, Alexis A.; Biesterfeldt, John P.; et al.
Journal of Medicinal Chemistry, 1991 , vol. 34, # 4 p. 1283 - 1292
反应条件
1: 4-benzyloxy-1H-indole-2-carboxylic acid ethyl ester With potassium hydroxide in trans-1,3-dioxane; water
2 h; Heating / reflux;
2: hydrogenchloride
参考文献
Mitsubishi Pharma Corporation
Patent: EP1188747 A1, 2002 ;
Location in patent: Page 58 ;
