1: triethylamine / copper(l) iodide; bis-triphenylphosphine-palladium(II) chloride / 20 °C
2: tetrabutyl ammonium fluoride / tetrahydrofuran / 1.5 h / 20 °C / Inert atmosphere
3: triethylamine / copper(l) iodide; bis-triphenylphosphine-palladium(II) chloride / 20 °C
4: potassium permanganate; acetic acid / dichloromethane; water / 3 h / 80 °C
5: hydrogenchloride; SnCl2·2H2O / water; acetic acid / 80 °C
View Scheme
参考文献
ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD.; AHN, Hee Choon; CHO, Young Jun; KWON, Hyuck Joo; KIM, Bong Ok; KIM, Sung Min
Patent: WO2011/132866 A1, 2011 ;