2-苯基噁唑-4-羧酸甲酯合成路线 （共 28 条）
反应条件
1: 99 percent / Rh2(OAc)4 / 12 h / 80 °C / other nitriles; other diazo compound; other catalysts and conditions
2: 1) LiBEt3H, 2) 30percent H2O2 / 1) THF, -78 deg C, 2 h, 2) THF, MeOH, 20 deg C, 2 h
View Scheme
参考文献
Connell; Tebbe; Gangloff; Helquist; Akermark
Tetrahedron, 1993 , vol. 49, # 25 p. 5445 - 5459
反应条件
1: triethylamine / dichloromethane / 0 - 20 °C
2: copper diacetate / N,N-dimethyl-formamide / 120 °C
View Scheme
参考文献
Li, Ziyuan; Ma, Ling; Xu, Jinyi; Kong, Lingyi; Wu, Xiaoming; Yao, Hequan
Chemical Communications, 2012 , vol. 48, # 31 p. 3763 - 3765
反应条件
1: hydroxylamine hydrochloride; sodium carbonate / methanol; water / Reflux
2: acetic anhydride / Reflux
3: hydrogenchloride / 0 - 20 °C
4: triethylamine / dichloromethane / 0 - 20 °C
5: copper diacetate / N,N-dimethyl-formamide / 120 °C
View Scheme
参考文献
Li, Ziyuan; Ma, Ling; Xu, Jinyi; Kong, Lingyi; Wu, Xiaoming; Yao, Hequan
Chemical Communications, 2012 , vol. 48, # 31 p. 3763 - 3765
反应条件
1: acetic anhydride / Reflux
2: hydrogenchloride / 0 - 20 °C
3: triethylamine / dichloromethane / 0 - 20 °C
4: copper diacetate / N,N-dimethyl-formamide / 120 °C
View Scheme
参考文献
Li, Ziyuan; Ma, Ling; Xu, Jinyi; Kong, Lingyi; Wu, Xiaoming; Yao, Hequan
Chemical Communications, 2012 , vol. 48, # 31 p. 3763 - 3765
反应条件
dihydrogen peroxide; lithium triethylborohydride
1) THF, -78 deg C, 2 h, 2) THF, MeOH, 20 deg C, 2 h; Yield given. Multistep reaction;
参考文献
Connell; Tebbe; Gangloff; Helquist; Akermark
Tetrahedron, 1993 , vol. 49, # 25 p. 5445 - 5459
参考文献
Cornforth; Cookson
Journal of the Chemical Society, 1952 , p. 1085,1087
反应条件
1: K2CO3 / methanol; H2O
2: lithium borohydride; MeOH / tetrahydrofuran
3: Dess-Martin periodinane / CH2Cl2
View Scheme
参考文献
Zylstra, Eric J.; She, Miles W.-L.; Salamant, Walter A.; Leahy, James W.
Synlett, 2007 , # 4 p. 623 - 627
反应条件
1: K2CO3 / methanol; H2O
2: lithium borohydride; MeOH / tetrahydrofuran
View Scheme
参考文献
Zylstra, Eric J.; She, Miles W.-L.; Salamant, Walter A.; Leahy, James W.
Synlett, 2007 , # 4 p. 623 - 627
