in neat (no solvent) byproducts: H2; (N2), Schlenk techniques; heating Sn compd. (200°C) under reducedpressure (1E-3 mm Hg) for 6 h or sealing Sn compd. under reduced pressu re (5E-1 mm Hg) with heating (200°C) for 4 h; isolation of crystals, NMR;
参考文献
Canadian Journal of Chemistry, , vol. 88, # 10 p. 1046 - 1052
