2,2,7,7-四甲基-3,5-辛二炔合成路线 （共 34 条）
反应条件
pyrrolidin-1-yl-2,5-dione; triethylamine; copper(I) bromide in N,N-dimethyl-formamide T=-20°C; 5 h; Inert atmosphere;
参考文献
Sueda, Takuya; Oshima, Ayumi; Teno, Naoki
Organic Letters, 2011 , vol. 13, # 15 p. 3996 - 3999
反应条件
tetrakis(triphenylphosphine) palladium(0) in 1,2-dichloro-ethane 100°C, 3 h, sealed glass ampul purged with argon; 0.5 M Me3SnCCBu-t, 1 M C3F7I, catalyst concn. 1 mol percent of the amount of Me3SnCCBu-t;
参考文献
Journal of General Chemistry USSR (English Translation), , vol. 59, p. 1620 - 1624
Zhurnal Obshchei Khimii, , vol. 59, p. 1818 - 1823
反应条件
diisopropylamine; bis-triphenylphosphine-palladium(II) chloride; copper(l) iodide in tetrahydrofuran Ambient temperature;
参考文献
Tetrahedron Letters, , vol. 32, # 11 p. 1449 - 1452
反应条件
bis(benzonitrile)palladium(II) dichloride in acetonitrile 100°C, 3 h, sealed glass ampul purged with argon; 0.5 M Me3SnCCBu-t, 1 M C3F7I, catalyst concn. 1 mol percent of the amount of Me3SnCCBu-t;
参考文献
Journal of General Chemistry USSR (English Translation), , vol. 59, p. 1620 - 1624
Zhurnal Obshchei Khimii, , vol. 59, p. 1818 - 1823
反应条件
triethylamine; copper(I) bromide in dichloromethane T=-20°C; 5 h; Inert atmosphere;
参考文献
Organic Letters, , vol. 13, # 15 p. 3996 - 3999
反应条件
triethylamine; copper(I) bromide in dichloromethane T=-20°C; 5 h; Inert atmosphere;
参考文献
Organic Letters, , vol. 13, # 15 p. 3996 - 3999
反应条件
triethylamine; copper(I) bromide in diethyl ether T=-20°C; 5 h; Inert atmosphere;
参考文献
Organic Letters, , vol. 13, # 15 p. 3996 - 3999
反应条件
triethylamine; copper(I) bromide in dichloromethane T=-20°C; 5 h; Inert atmosphere;
参考文献
Organic Letters, , vol. 13, # 15 p. 3996 - 3999
反应条件
triethylamine; copper(I) bromide in dichloromethane T=-20°C; 5 h; Inert atmosphere;
参考文献
Organic Letters, , vol. 13, # 15 p. 3996 - 3999
反应条件
bis-triphenylphosphine-palladium(II) chloride in tetrahydrofuran T=22°C;
参考文献
Negishi, Ei-ichi; Akiyoshi, Kazunari; Takahashi, Tamotsu
Journal of the Chemical Society, Chemical Communications, 1987 , # 6 p. 477 - 478
