N,5-二甲基-2-硝基苯胺合成路线 （共 23 条）
反应条件
1: tin; hydrochloric acid / Behandeln mit Eisessig 2: beim Erhitzen View Scheme
参考文献
Chemische Berichte, , vol. 35, p. 1259
反应条件
palladium on activated charcoal; ethanol Hydrogenation.Erhitzen des Reaktionsprodukts mit Ameisensaeure und wss. HCl;
参考文献
Beaven et al.
Journal of Pharmacy and Pharmacology, 1949 , vol. 1, p. 957,968
反应条件
1: 75 percent / 1.) H2 (50 psi), 2.) conc. HCl / 5percent Pd on carbon / methanol / 1.5 h 2: 4 N HCl / 4 h / Heating View Scheme
参考文献
Skibo, Edward B.; Islam, Imadul; Heileman, Matthew J.; Schulz, William G.
Journal of Medicinal Chemistry, 1994 , vol. 37, # 1 p. 78 - 92
反应条件
ethanol; palladium Hydrogenation;
参考文献
Hasford, Justin J.; Rizzo, Carmelo J.
Journal of the American Chemical Society, 1998 , vol. 120, # 10 p. 2251 - 2255
参考文献
Brady; Reynolds
Journal of the Chemical Society, 1928 , p. 198,199
Journal of the Chemical Society, 1931 , p. 1274,1277
反应条件
in ethanol
T=80°C; 2 h;
参考文献
PFIZER PRODUCTS INC.
Patent: WO2008/75196 A1, 2008 ;
Location in patent: Page/Page column 97; 105 ;
反应条件
1: trifluoroacetic acid / 1 h / Ambient temperature
2: KOH / acetone / 8 h / Heating
View Scheme
参考文献
Skibo, Edward B.; Islam, Imadul; Heileman, Matthew J.; Schulz, William G.
Journal of Medicinal Chemistry, 1994 , vol. 37, # 1 p. 78 - 92
反应条件
sodium hydride in N,N-dimethyl-formamide
T=0°C; 1 h;
参考文献
Jean-Claude, Bertrand J.; Just, George
Heterocycles, 1998 , vol. 48, # 7 p. 1347 - 1363
反应条件
copper in water
T=100°C; 8 h; Sealed tube;
参考文献
Windisch, Marc Peter; Jo, Suyeon; Kim, Hee-Young; Kim, Soo-Hyun; Kim, Keumhyun; Kong, Sunju; Jeong, Hyangsuk; Ahn, Sujin; No, Zaesung; Hwang, Jong Yeon
European Journal of Medicinal Chemistry, 2014 , vol. 78, p. 35 - 42
反应条件
sodium hydroxide; tetra(n-butyl)ammonium hydrogensulfate in water; toluene
6 h; Product distribution / selectivity;
参考文献
Egle, Ian; Isaac, Methvin; Urbanek, Rebecca; McLaren, Frances M.; Walsh, Sally B.; Steelman, Gary B.; Brown, Dean G.; Nugiel, David; Chen, Deborah W.; Slassi, Abdelmalik; Ma, Fupeng
Patent: US2009/192169 A1, 2009 ;
Location in patent: Page/Page column 54 ;
