N-均三甲苯基-2-噻吩甲酰胺合成路线 （共 6 条）
反应条件
triethylamine in dichloromethane
12 h; Heating;
参考文献
Barcock, Richard A.; Chadwick, Derek J.; Storr, Richard C.; Fuller, Lance S.; Young, John H.
Tetrahedron, 1994 , vol. 50, # 14 p. 4149 - 4166
反应条件
1: SOCl2 / 5 h / Heating
2: 95 percent / Et3N / CH2Cl2 / 12 h / Heating
View Scheme
参考文献
Barcock, Richard A.; Chadwick, Derek J.; Storr, Richard C.; Fuller, Lance S.; Young, John H.
Tetrahedron, 1994 , vol. 50, # 14 p. 4149 - 4166
反应条件
1: 97 percent / 10 percent aq. HCl / dioxane / 1 h / Heating
2: SOCl2 / 5 h / Heating
3: 95 percent / Et3N / CH2Cl2 / 12 h / Heating
View Scheme
参考文献
Barcock, Richard A.; Chadwick, Derek J.; Storr, Richard C.; Fuller, Lance S.; Young, John H.
Tetrahedron, 1994 , vol. 50, # 14 p. 4149 - 4166
反应条件
1: 96 percent / SOCl2 / 18 h / Heating
2: 97 percent / methanol; tetrahydrofuran / 1.) 0 deg C, 0.5 h, 2.) room temperature, 12 h
3: 76 percent / 10 percent aq. HCl / 0.5 h / Ambient temperature
4: 97 percent / 10 percent aq. HCl / dioxane / 1 h / Heating
5: SOCl2 / 5 h / Heating
6: 95 percent / Et3N / CH2Cl2 / 12 h / Heating
View Scheme
参考文献
Barcock, Richard A.; Chadwick, Derek J.; Storr, Richard C.; Fuller, Lance S.; Young, John H.
Tetrahedron, 1994 , vol. 50, # 14 p. 4149 - 4166
反应条件
1: 76 percent / 10 percent aq. HCl / 0.5 h / Ambient temperature
2: 97 percent / 10 percent aq. HCl / dioxane / 1 h / Heating
3: SOCl2 / 5 h / Heating
4: 95 percent / Et3N / CH2Cl2 / 12 h / Heating
View Scheme
参考文献
Barcock, Richard A.; Chadwick, Derek J.; Storr, Richard C.; Fuller, Lance S.; Young, John H.
Tetrahedron, 1994 , vol. 50, # 14 p. 4149 - 4166
反应条件
1: 97 percent / methanol; tetrahydrofuran / 1.) 0 deg C, 0.5 h, 2.) room temperature, 12 h
2: 76 percent / 10 percent aq. HCl / 0.5 h / Ambient temperature
3: 97 percent / 10 percent aq. HCl / dioxane / 1 h / Heating
4: SOCl2 / 5 h / Heating
5: 95 percent / Et3N / CH2Cl2 / 12 h / Heating
View Scheme
参考文献
Barcock, Richard A.; Chadwick, Derek J.; Storr, Richard C.; Fuller, Lance S.; Young, John H.
Tetrahedron, 1994 , vol. 50, # 14 p. 4149 - 4166
