1: With triethylamine; triphenylphosphine; [Cu(I)(CH3CN)4]PF6 in tetrahydrofuran T=20°C; 5 h; 2: With 1,8-diazabicyclo[5.4.0]undec-7-ene in tetrahydrofuran T=20°C; 0.5 h; Further stages.;

[Ru(4,4′-di-tert-butyl-2,2′-bipyridine)3](PF6)2 in chloroform T=20°C; 4 h; Schlenk techniqueInert atmosphereIrradiation; Concentration;

1: 67 percent / pyridine / CH2Cl2 / 3 h / 0 - 20 °C 2: 50 percent / 1,2-bis(diphenylphosphino)ethane / tetrakis(triphenylphosphine)palladium(0) / tetrahydrofuran / 24 h / 20 °C 3: 66 percent / aq. HCl / diethyl ether / 1 h 4: 6.50 g / DMAP; Et3N / CH2Cl2 / 20 °C 5: 76 percent / K2CO3; iodine / acetonitrile / 3 h / 20 °C 6: 82 percent / DBU / dimethylformamide / 1 h / 90 °C View Scheme

1: 50 percent / 1,2-bis(diphenylphosphino)ethane / tetrakis(triphenylphosphine)palladium(0) / tetrahydrofuran / 24 h / 20 °C 2: 66 percent / aq. HCl / diethyl ether / 1 h 3: 6.50 g / DMAP; Et3N / CH2Cl2 / 20 °C 4: 76 percent / K2CO3; iodine / acetonitrile / 3 h / 20 °C 5: 82 percent / DBU / dimethylformamide / 1 h / 90 °C View Scheme

1: 76 percent / K2CO3; iodine / acetonitrile / 3 h / 20 °C 2: 82 percent / DBU / dimethylformamide / 1 h / 90 °C View Scheme

1: 6.50 g / DMAP; Et3N / CH2Cl2 / 20 °C 2: 76 percent / K2CO3; iodine / acetonitrile / 3 h / 20 °C 3: 82 percent / DBU / dimethylformamide / 1 h / 90 °C View Scheme

1: 66 percent / aq. HCl / diethyl ether / 1 h 2: 6.50 g / DMAP; Et3N / CH2Cl2 / 20 °C 3: 76 percent / K2CO3; iodine / acetonitrile / 3 h / 20 °C 4: 82 percent / DBU / dimethylformamide / 1 h / 90 °C View Scheme

in xylene Heating;