2,2,2-三氟乙醇合成路线 （共 1089 条）
反应条件
T=62.5°C; also in the presence of H2O; influence of pyridine and HClO4; Rate constantProduct distribution;
参考文献
D'Souza, Malcolm J.; Kevill, Dennis N.; Bentley, T. William; Devaney, Angela C.
Journal of Organic Chemistry, 1995 , vol. 60, # 6 p. 1632 - 1637
反应条件
water T=25°C; Solvolysis; Kinetics; Concentration;
参考文献
Bentley, T. William; Koo, In Sun
Arkivoc, 2012 , vol. 2012, # 7 p. 25 - 34
反应条件
sodium perchlorate in water T=25°C; Equilibrium constant;
参考文献
Rothenberg, Marc E.; Richard, John P.; Jencks, William P.
Journal of the American Chemical Society, 1985 , vol. 107, # 5 p. 1340 - 1346
反应条件
water in acetonitrile T=25°C; various composition of trifluoroethanol/ethanol; solvolytic reaction; role of nucleophilic and other solvation effects; product selectivity; various temp.; ΔH(activ.), ΔS(activ.); Rate constantThermodynamic data;
参考文献
Journal of Organic Chemistry, , vol. 63, # 14 p. 4654 - 4659
反应条件
water T=25°C; Solvolysis; Kinetics; Concentration;
参考文献
Bentley, T. William; Koo, In Sun
Arkivoc, 2012 , vol. 2012, # 7 p. 25 - 34
反应条件
sulfuric acid in water; acetonitrile T=21°C; 1 h; Irradiationinvestigation of the selectivity of the phenethyl carbenium ion in the photoaddition of a binary aq. sol. of the corresponding alcohol; structural and nucleophilic effects are discussed; Product distributionQuantum yieldRate constant;
参考文献
Anderson, Steven W.; Yates, Keith
Canadian Journal of Chemistry, 1988 , vol. 66, p. 2412 - 2421
反应条件
in water T=25°C; different solvent/reagent ratio; other solvent; Product distributionRate constant;
参考文献
Journal of the American Chemical Society, , vol. 108, # 4 p. 842 - 844
反应条件
T=25°C; other temperature (50 deg C); solvolysis of β-silyl systems, conformation effect; Rate constant;
参考文献
Journal of the American Chemical Society, , vol. 104, # 7 p. 2020 - 2022
反应条件
T=25°C; solvolysis of β-silyl systems; Rate constant;
参考文献
Journal of the American Chemical Society, , vol. 104, # 7 p. 2020 - 2022
反应条件
iodine; potassium carbonate T=50°C; 18 h;
参考文献
Synlett, , # 5 p. 880 - 882
