3,4-二氢-2H-1-苯并吡喃-3,8-二醇合成路线 (共 6 条)
反应条件
1: 1.) ethyl chloroformate, triethylamine; 2.) Ac2O, fum. HNO3; 3.) NaOH / 1.) THF, 0-5 deg C, 0.5 h; 2.) acetonitrile, -8 deg C, 1 h; 3.) MeOH, H2O, RT, 0.5 h 2: 1 N NaOH / 2 h / 50 °C 3: methanol / 1 h / 70 °C View Scheme
参考文献
Shiratsuchi; Kawamura; Akashi; Fujii; Ishihama; Uchida
Chemical and Pharmaceutical Bulletin, 1987 , vol. 35, # 2 p. 632 - 641
反应条件
hydrogen bromide
T=90°C; 9 h;
参考文献
Shiratsuchi; Kawamura; Akashi; Fujii; Ishihama; Uchida
Chemical and Pharmaceutical Bulletin, 1987 , vol. 35, # 2 p. 632 - 641
反应条件
1: 88.7 percent / 40 percent (w/v) peracetic acid, AcOK / CH2Cl2 / 48 h / Ambient temperature
2: 90.4 percent / 20 percent (w/v) HCl / diethyl ether / 12 h / Ambient temperature
3: 1.53 g / K2CO3 / dimethylformamide / 2 h / Ambient temperature
4: 52.1 percent / 1 N NaOH / methanol / 1 h / Ambient temperature
5: 88.9 percent / 47 percent HBr / 9 h / 90 °C
View Scheme
参考文献
Shiratsuchi; Kawamura; Akashi; Fujii; Ishihama; Uchida
Chemical and Pharmaceutical Bulletin, 1987 , vol. 35, # 2 p. 632 - 641
反应条件
1: 52.1 percent / 1 N NaOH / methanol / 1 h / Ambient temperature
2: 88.9 percent / 47 percent HBr / 9 h / 90 °C
View Scheme
参考文献
Shiratsuchi; Kawamura; Akashi; Fujii; Ishihama; Uchida
Chemical and Pharmaceutical Bulletin, 1987 , vol. 35, # 2 p. 632 - 641
反应条件
1: 90.4 percent / 20 percent (w/v) HCl / diethyl ether / 12 h / Ambient temperature
2: 1.53 g / K2CO3 / dimethylformamide / 2 h / Ambient temperature
3: 52.1 percent / 1 N NaOH / methanol / 1 h / Ambient temperature
4: 88.9 percent / 47 percent HBr / 9 h / 90 °C
View Scheme
参考文献
Shiratsuchi; Kawamura; Akashi; Fujii; Ishihama; Uchida
Chemical and Pharmaceutical Bulletin, 1987 , vol. 35, # 2 p. 632 - 641
反应条件
1: 1.53 g / K2CO3 / dimethylformamide / 2 h / Ambient temperature
2: 52.1 percent / 1 N NaOH / methanol / 1 h / Ambient temperature
3: 88.9 percent / 47 percent HBr / 9 h / 90 °C
View Scheme
参考文献
Shiratsuchi; Kawamura; Akashi; Fujii; Ishihama; Uchida
Chemical and Pharmaceutical Bulletin, 1987 , vol. 35, # 2 p. 632 - 641