1: 1.) H2CO3H; 2.) 5 percent KOH / 1.) formic acid, overnight; 2.) ether, 2 h 2: dimethylformamide / 4 h / Heating 3: Raney-Ni / H2O; formic acid / 2 h / Heating 4: 1.) HCO3H; 2.) 5 percent KOH / 1.) formic acid; 2.) ether 5: 1.8 g / K2CO3 / dimethylformamide / 1 h / 120 °C / Heating 6: 400 mg / POCl3 / Ambient temperature View Scheme

1: 29 g / K2CO3 / acetone / 3 h / Heating 2: 1.) H2CO3H; 2.) 5 percent KOH / 1.) formic acid, overnight; 2.) ether, 2 h 3: dimethylformamide / 4 h / Heating 4: Raney-Ni / H2O; formic acid / 2 h / Heating 5: 1.) HCO3H; 2.) 5 percent KOH / 1.) formic acid; 2.) ether 6: 1.8 g / K2CO3 / dimethylformamide / 1 h / 120 °C / Heating 7: 400 mg / POCl3 / Ambient temperature View Scheme

1: Raney-Ni / H2O; formic acid / 2 h / Heating 2: 1.) HCO3H; 2.) 5 percent KOH / 1.) formic acid; 2.) ether 3: 1.8 g / K2CO3 / dimethylformamide / 1 h / 120 °C / Heating 4: 400 mg / POCl3 / Ambient temperature View Scheme

1: dimethylformamide / 4 h / Heating 2: Raney-Ni / H2O; formic acid / 2 h / Heating 3: 1.) HCO3H; 2.) 5 percent KOH / 1.) formic acid; 2.) ether 4: 1.8 g / K2CO3 / dimethylformamide / 1 h / 120 °C / Heating 5: 400 mg / POCl3 / Ambient temperature View Scheme

1: 1.8 g / K2CO3 / dimethylformamide / 1 h / 120 °C / Heating 2: 400 mg / POCl3 / Ambient temperature View Scheme

1: 1.) HCO3H; 2.) 5 percent KOH / 1.) formic acid; 2.) ether 2: 1.8 g / K2CO3 / dimethylformamide / 1 h / 120 °C / Heating 3: 400 mg / POCl3 / Ambient temperature View Scheme

trichlorophosphate Ambient temperature;