4-氨基-1-甲基-1H-吡唑-5-甲酰胺合成路线 （共 5 条）
反应条件
hydrazine hydrate; nickel in isopropyl alcohol T=55 - 60°C;
参考文献
Perevalov, V. P.; Andreeva, M. A.; Manaev, Yu. A.; Isaev, Sh. G.; Baryshnenkova, L. I.; Stepanov, B. I.
Journal of Organic Chemistry USSR (English Translation), 1984 , vol. 20, # 5 p. 976 - 980
Zhurnal Organicheskoi Khimii, 1984 , vol. 20, # 5 p. 1073 - 1078
反应条件
1: 96 percent / nitric acid (d 1.52), sulfuric acid monohydrate / 1.) 30-40 deg C, 1 h; 2.) 75-80 deg C, 2 h 2: 1.) thionyl chloride; 2.) 25percent aqueous ammonia / 1.) reflux, 4 h; 2.) 10 deg C 3: 84 percent / 95percent hydrazine hydrate / Raney nickel / propan-2-ol / 55 - 60 °C View Scheme
参考文献
Journal of Organic Chemistry USSR (English Translation), , vol. 20, # 5 p. 976 - 980
Zhurnal Organicheskoi Khimii, , vol. 20, # 5 p. 1073 - 1078
反应条件
1: 75 percent / potassium permanganate 2: 96 percent / nitric acid (d 1.52), sulfuric acid monohydrate / 1.) 30-40 deg C, 1 h; 2.) 75-80 deg C, 2 h 3: 1.) thionyl chloride; 2.) 25percent aqueous ammonia / 1.) reflux, 4 h; 2.) 10 deg C 4: 84 percent / 95percent hydrazine hydrate / Raney nickel / propan-2-ol / 55 - 60 °C View Scheme
参考文献
Journal of Organic Chemistry USSR (English Translation), , vol. 20, # 5 p. 976 - 980
Zhurnal Organicheskoi Khimii, , vol. 20, # 5 p. 1073 - 1078
反应条件
1: 1.) thionyl chloride; 2.) 25percent aqueous ammonia / 1.) reflux, 4 h; 2.) 10 deg C 2: 84 percent / 95percent hydrazine hydrate / Raney nickel / propan-2-ol / 55 - 60 °C View Scheme
参考文献
Journal of Organic Chemistry USSR (English Translation), , vol. 20, # 5 p. 976 - 980
Zhurnal Organicheskoi Khimii, , vol. 20, # 5 p. 1073 - 1078
反应条件
1.1: 2 h / 200 °C / Neat (no solvent)
2.1: 1,8-diazabicyclo[5.4.0]undec-7-ene; trichlorophosphate / 8 h / 50 - 80 °C / Inert atmosphere
2.2: pH 7
View Scheme
参考文献
Lee, Wendy; Ortwine, Daniel F.; Bergeron, Philippe; Lau, Kevin; Lin, Lichuan; Malek, Shiva; Nonomiya, Jim; Pei, Zhonghua; Robarge, Kirk D.; Schmidt, Stephen; Sideris, Steve; Lyssikatos, Joseph P.
Bioorganic and Medicinal Chemistry Letters, 2013 , vol. 23, # 18 p. 5097 - 5104
