water T=100°C; 1 h;

copper in various solvent(s) T=180°C; 0.833333 h;

1: 88 percent / conc. H2SO4, 90percent HNO3 / 0.5 h / 0 - 10 °C 2: 68 percent / SnCl2*2H2O, conc. HCl / 1.17 h / 24 - 25 °C 3: 1.) nitrosylsulfuric acid, 2.) sodium azide; / 1.) acetic anhydride, acetic acid, 20-35 deg C, 30 min, 2.) 25 deg C, 15 min; 4: 80 percent / Cu powder / various solvent(s) / 0.83 h / 180 °C View Scheme

1: 68 percent / SnCl2*2H2O, conc. HCl / 1.17 h / 24 - 25 °C 2: 1.) nitrosylsulfuric acid, 2.) sodium azide; / 1.) acetic anhydride, acetic acid, 20-35 deg C, 30 min, 2.) 25 deg C, 15 min; 3: 80 percent / Cu powder / various solvent(s) / 0.83 h / 180 °C View Scheme

1: 1.) nitrosylsulfuric acid, 2.) sodium azide; / 1.) acetic anhydride, acetic acid, 20-35 deg C, 30 min, 2.) 25 deg C, 15 min; 2: 80 percent / Cu powder / various solvent(s) / 0.83 h / 180 °C View Scheme

1: 1.) PCl5, 2.) 97percent formic acid; / 1.) 105 deg C, 18.5 h; 2: 88 percent / conc. H2SO4, 90percent HNO3 / 0.5 h / 0 - 10 °C 3: 68 percent / SnCl2*2H2O, conc. HCl / 1.17 h / 24 - 25 °C 4: 1.) nitrosylsulfuric acid, 2.) sodium azide; / 1.) acetic anhydride, acetic acid, 20-35 deg C, 30 min, 2.) 25 deg C, 15 min; 5: 80 percent / Cu powder / various solvent(s) / 0.83 h / 180 °C View Scheme