4-溴甲基苯硼酸频哪醇酯合成路线 （共 29 条）
反应条件
1.1: 100 percent / tetrahydrofuran; toluene 2.1: 80 percent / NaBH4 / methanol / 0.17 h / 4 °C 3.1: Et3N; MsCl / CH2Cl2 / 1 h / 4 °C 3.2: 88 percent / LiBr / acetone / Heating View Scheme
参考文献
Synthetic Communications, , vol. 32, # 17 p. 2669 - 2676
反应条件
1.1: 80 percent / NaBH4 / methanol / 0.17 h / 4 °C 2.1: Et3N; MsCl / CH2Cl2 / 1 h / 4 °C 2.2: 88 percent / LiBr / acetone / Heating View Scheme
参考文献
Synthetic Communications, , vol. 32, # 17 p. 2669 - 2676
反应条件
PS-NMM in tetrahydrofuran T=150°C; 0.583333 h; Microwave irradiationin air;
参考文献
ACS Combinatorial Science, , vol. 13, # 1 p. 24 - 31
反应条件
PS-NMM in tetrahydrofuran T=150°C; 0.75 h; Microwave irradiationin air;
参考文献
Spencer, John; Baltus, Christine B.; Patel, Hiren; Press, Neil J.; Callear, Samantha K.; Male, Louise; Coles, Simon J.
ACS Combinatorial Science, 2011 , vol. 13, # 1 p. 24 - 31
反应条件
1: dichloromethane / 72 h / 20 °C 2: dihydrogen peroxide / water-d2; dimethyl sulfoxide / 24 h / pH 7.5 / aq. phosphate buffer View Scheme
参考文献
Kuang, Yunyan; Balakrishnan, Kumudha; Gandhi, Varsha; Peng, Xiaohua
Journal of the American Chemical Society, 2011 , vol. 133, # 48 p. 19278 - 19281
反应条件
in tetrahydrofuran; water T=20°C;
参考文献
HUTCHISON MEDIPHARMA LIMITED; Su, Wei-Guo; Deng, Wei; Ji, Jianguo
Patent: US2014/121200 A1, 2014 ;
Location in patent: Paragraph 0148; 0149 ;
反应条件
potassium carbonate in N,N-dimethyl-formamide T=80°C; 1 h;
参考文献
ABBOTT LABORATORIES
Patent: US2011/281842 A1, 2011 ;
Location in patent: Page/Page column 75 ;
反应条件
potassium carbonate in N,N-dimethyl-formamide T=80°C; 0.75 h;
参考文献
NOVARTIS AG
Patent: WO2009/10488 A1, 2009 ;
Location in patent: Page/Page column 57-58 ;
WO 2009/010488 A1
反应条件
PS-NMM in tetrahydrofuran T=150°C; 0.25 h; Microwave irradiationin air;
参考文献
Spencer, John; Baltus, Christine B.; Patel, Hiren; Press, Neil J.; Callear, Samantha K.; Male, Louise; Coles, Simon J.
ACS Combinatorial Science, 2011 , vol. 13, # 1 p. 24 - 31
反应条件
caesium carbonate in N,N-dimethyl-formamide 18 h;
参考文献
INFINITY DISCOVERY, INC.
Patent: WO2008/63300 A2, 2008 ;
Location in patent: Page/Page column 215 ;
WO 2008/063300 A2
