copper in neat (no solvent) byproducts: CuCOCl; High Pressure; heating for 30 h ReCl5 and Cu in rotary autoclave with CO at 200 atm to 230 °C;; extg. with boiling benzene, pptn. on cooling;;
CO in n-heptane CCl4 (2.04 mg, 0.013 mmol) added to a heptane solution (7 ml) of (η3-CPh3)Re(CO)4 (7.2 mg, 0.013 mmol), solution was degassed and stirred for 30 min under CO (20 psi);; detected by IR;;
acetonitrile in acetonitrile Kinetics; byproducts: Re2(CO)9(MeCN); Irradiation (UV/VIS); Ar-atmosphere; Nd:Yag laser pulses (351 and 355 nm); not isolated, reaction followed by UV/VIS spectroscopy;
acetonitrile in acetonitrile Kinetics; byproducts: Re2(CO)9(MeCN); Irradiation (UV/VIS); Ar-atmosphere; Nd:Yag laser pulses (351 and 355 nm); not isolated, reaction followed by UV/VIS spectroscopy;
acetonitrile in acetonitrile Kinetics; byproducts: Re2(CO)9(MeCN); Irradiation (UV/VIS); Ar-atmosphere; Nd:Yag laser pulses (351 and 355 nm); not isolated, reaction followed by UV/VIS spectroscopy;
tetrachloromethane; carbon monoxide in perdeuterocyclohexane addn. of CCl4 (20percent enriched in (13)C) to Re-complex (vac.), addn. of C6D12, pressure of 3 atm CO (10 h), pptn.;
iron(III) chloride in acetonitrile Kinetics; Schlenk flask, N2; the decacarbonyl is added to MeCN, oxidant (2 equiv)is added and stirred until dissolved; IR, UV;
