1-噻吩-2-基-乙酮肟合成路线 （共 27 条）
反应条件
hydrogenchloride; ethanol; zinc
参考文献
Putochin; Egorowa
Zhurnal Obshchei Khimii, 1948 , vol. 18, p. 1866,1867
Chem.Abstr., 1949 , p. 3817
反应条件
sodium hydroxide; polymer-QX; CH2PBu3Cl in benzene T=80°C; Methylation; 5 h;
参考文献
Rubina; Gaukhman; Lukevits
Russian Journal of Organic Chemistry, 1998 , vol. 34, # 9 p. 1361 - 1362
反应条件
sodium hydroxide in water; N,N-dimethyl-formamide T=10°C; 0.5 h;
参考文献
Goda; Sato; Ihara; Hirayama
Synthesis, 1992 , # 9 p. 849 - 851
反应条件
1: 95 percent / NaOH / dimethylformamide; H2O / 0.5 h / 10 °C 2: 62 percent / Fe, Cl2 / CHCl3 / 3 h / Heating 3: 96 percent / 25percent HCl / 8 h / 70 °C View Scheme
参考文献
Goda; Sato; Ihara; Hirayama
Synthesis, 1992 , # 9 p. 849 - 851
反应条件
SnCl2·2H2O; tetra-(n-butyl)ammonium iodide in acetonitrile Beckmann Rearrangement; 1 h; Molecular sieveReflux;
参考文献
Ganguly, Nemai C.; Nayek, Subhasis; Chandra, Sumanta
Journal of the Indian Chemical Society, 2013 , vol. 90, # 10 p. 1695 - 1702
参考文献
Steinkopf
Justus Liebigs Annalen der Chemie, 1914 , vol. 403, p. 35
反应条件
1: 95 percent / NaOH / dimethylformamide; H2O / 0.5 h / 10 °C 2: 75 percent / acetyl nitrate, Ac2O / 3 h / Ambient temperature View Scheme
参考文献
Goda; Sato; Ihara; Hirayama
Synthesis, 1992 , # 9 p. 849 - 851
反应条件
1: 95 percent / NaOH / dimethylformamide; H2O / 0.5 h / 10 °C
2: 64 percent / polyphosphoric acid / 9 h / 100 °C
3: 86 percent / 25percent HCl / 8 h / 70 °C
View Scheme
参考文献
Goda; Sato; Ihara; Hirayama
Synthesis, 1992 , # 9 p. 849 - 851
反应条件
acetyl chloride
anschliessend Erhitzen unter vermindertem Druck;
参考文献
Steinkopf; Thormann
Justus Liebigs Annalen der Chemie, 1939 , vol. 540, p. 1,5
反应条件
potassium hydroxide; dimethyl sulfoxide
T=120°C; P=14.1 - 16.2 Torr; 3 h;
参考文献
Schmidt, Elena Yu.; Trofimov, Boris A.; Mikhaleva, Al'bina I.; Zorina, Nadezhda V.; Protzuk, Nadezhda I.; Petrushenko, Konstantin B.; Ushakov, Igor A.; Dvorko, Marina Yu.; Meallet-Renault, Rachel; Clavier, Gilles; Vu, Thanh Truc; Tran, Ha Thanh Thao; Pansu, Robert B.
Chemistry - A European Journal, 2009 , vol. 15, # 23 p. 5823 - 5830
