sodium hydroxide; N-hexadecyl-N,N,N-trimethylammonium bromide in water; ethylenediamine High Pressure; cetyltrimethylammonium bromide dissolved (H2O, ethylenediamine); Cu(CH3COO)2 and CS(NH2)2 added to soln.; pH=12 of soln. adjusted by NaOH; sealed into autoclaves; Cu foil immersed in soln.; heated at 160°C for10 h; cooled to room temp.; XRD; TEM;
参考文献
Journal of Alloys and Compounds, , vol. 479, # 1-2 p. L43-L46
LiCl; HCl in water Electrochem. Process; electrodeposited from 12.5 mM CuCl2, 10 mM InCl3, 40 mM Na2S2O3, 100 mM LiCl (pH 2.5 adjusted with dild. HCl) at 30°C and -1.0 V (vs. SCE) for 30 min; annealed in Ar at 350°C for 60 min; XRD;
