反应条件
nickel sulphate; boric acid in water
Kinetics; byproducts: H2; deposition of Cu from electroless plating bath (aq. CuSO4/NiSO4/H3BO3/NaH2PO2 and compleing agent (Na-citrate, Na,K-tartrate, oxalic acid, glycine, malic acid, EDTA, phthalic acid, succinic acid, lactic acid or ethylenediamine)), 65°C, 10 min;
参考文献
Hung; Chen
Journal of the Electrochemical Society, 1989 , vol. 136, # 1 p. 72 - 75